THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUM

专利名称：THERMALLY ENHANCED SEMICONDUCTOR

ASSEMBLY WITH BUMP/BASE/FLANGE HEATSPREADER AND BUILD-UP CIRCUITRY

发明人：Charles W. C. LIN,Chia-Chung WANG申请号：US13197163申请日：20110803

公开号：US20120126399A1公开日：20120524

专利附图：

摘要：A semiconductor assembly includes a semiconductor device, a heat spreader, anadhesive and a build-up circuitry. The heat spreader includes a bump, a base and a flange.The bump defines a cavity. The semiconductor device is mounted on the bump at thecavity, electrically connected to the build-up circuitry and thermally connected to thebump. The bump extends from the base into an opening in the adhesive, the baseextends vertically from the bump opposite the cavity and the flange extends laterallyfrom the bump at the cavity entrance. The build-up circuitry includes a dielectric layer andconductive traces on the semiconductor device and the flange. The conductive tracesprovide signal routing for the semiconductor device.

申请人：Charles W. C. LIN,Chia-Chung WANG

地址：Singapore SG,Judung Jen Hsinchu TW

国籍：SG,TW

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