专利名称：Methods of making microelectronic
packages
发明人：John W. Smith申请号：US11197247申请日：20050804
公开号：US20050272182A1公开日：20051208
专利附图：
摘要：A method of making a microelectronic package includes providing a firstsubstrate having a top surface, providing a second substrate having a top surfaceincluding a plurality of conductive pads, a bottom surface remote therefrom and anopening extending between the top and bottom surfaces, and securing the secondsubstrate over the first substrate so that the bottom surface of the second substrateconfronts the top surface of the first substrate, wherein the first and second substrateshave coefficients of thermal expansion that are substantially similar to one another. Themethod also includes placing a microelectronic element having a front face with contactsand a back face remote therefrom in the opening of the second substrate and securingthe microelectronic element over the first substrate so that the back face of the
microelectronic element confronts the top surface of the first substrate, and electrically
interconnecting the contacts of the microelectronic element with the conductive pads ofthe second substrate.
申请人：John W. Smith
地址：Horseshoe Bay TX US
国籍：US
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