PCB常用英文词汇汇编

A a

A.O.I(Automatic Optical Inspection)自动光学检查Acceptable quality level (AQL)可接受质量水平Accuracy精确度Activating

活化

Active carbon treatment活性碳处理After Pressed Thickness压板后之厚度Alignment校直，结盟Annular ring锡圈

Anti-Static Bag

静电胶袋

B b

Backplane背板Back-up垫板Baking

烘板

Ball Grid Array (BGA)球栅阵列Bare board裸板Base Copper底铜Base material基材Bevelling斜边Black Oxide黑氧化Blind via hole

盲孔

C c

C/M(Component Marking)元件字符Carbon ink碳油Carrier带板Ceramic substrate陶瓷Certificate of Compliance合格证书Chamfer倒角Chemical cleaning化学清洗Chemical corrosion化学腐蚀Chip Scale Package (CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色Component Side(C/S)元件面Composite layers复合层Computer Aided Design (CAD)电脑辅助设计Computer Aided Manufacturing (CAM)电脑辅助制作Computer Numerial Control (CNC)数控Conductor导体D d

D/F Registration Hole干菲林对位孔D/F(Dry Film)干膜

Date Code日期代号Datum hole基准参考孔Daughter board子板Deburring去毛刺Defect缺陷Definition定义Delamination分层Delay耽搁Delivery交货

Densitomefer

透光度计ApparatusAreaArtwork

Artwork DrawingArtwork Film

Artwork ModificationArtwork No.AssemblyAxis

BlisteringBoard CuttingBoard ThicknessBottom sideBreakaway tabBrushingBuild-upBullet padBuried holeConductor width/spaceContactCopper areaCopper cladCopper foilCopper platingCorner

Corner mark

Corner REG.HoleCrackingCreasingCriteria

Crossection areaCu/Sn PlatingCurrent efficiencyCustomer

Customer Drilling FileCustomer P/NDiamondDiazo film

Dielectric breakdownDielectric constantDielectric ThicknessDielectric Voltage TestDimension

Dimensional stabilityDirect/indirectDistributionDocument type

Documentation Control设备，仪器面积菲林

菲林图形原装菲林菲林修改菲林编号组装，装配轴

起泡/水泡开料板厚底层打断点磨刷积层子弹盘埋孔

导体线宽/线隙接点铜面积铜箔铜箔电镀铜角线

板角记号角位对位孔裂缝皱折

规格,标准切面镀铜锡电流效率客户

客户钻孔资料客户产品编号

钻石重氮片介电击穿介电常数介电层厚度绝缘测试尺寸

尺寸稳定性直接/间接发放

文件种类文件控制

PCB常用英文词汇汇编

Density密度Department部门Description说明

Design origin设计原点Desmear去钻污,除胶Dessicant防潮珠

Developer

显影液,显影机

E e

ECN(Engineering Change Notification)工程更改通知Effective date有效期Electrical Test Fixture电测试 针床Electro migration漏电Electroconductive paste导电胶Electroless无电沉Electroless copper无电沉铜Electroless Ni无电沉镍Electroless Gold/Au无电沉金Engineering drawing工程图纸F f

Fiducial mark基准点Filling

填充

Film Fabrication菲林制作Final QC

最终检查

Finish Overall Board Thickness成品总板厚度G g

General information一般资料Ghost image

重影

Glass transition temperature玻璃化湿度Gold Finger(G/F)金手指

H h

HAL(Hot Air Leveling)热风整平Hand Rout手锣Hardness硬度Heat Sealed

热密封Heat Shrink-warp热收缩Holding time停留时间Hole

孔Hole breakout

破环I

Identification标识,指标Image

影像

Imaging transfer图形转移Impedance阻抗

Impedance Test阻抗测试Inner copper foil 内层铜箔Inspection

检验

Insulation resistance Test绝缘测试K k

KEY board按键盘Key slot

槽孔

Double sided boardDrill bitDrilling

Drilling RoughnessDry Film

Dry Film-PatternDynamic

Entek

Epoxy glass substrateEpoxy resinEtchEtchbackEtching

E-Test Marking

E-Test(Electrical Test)ExposureExternal layerFixture

FlammabilityFlash GoldFlexibleFluxGolden boardGrid

Ground planeHole densityHole DiameterHole location

Hole Location ChartHole Position ToleranceHole size

Hot Air Leveling(HAL)HumidityInter Plane SeparationInterleave PaperInternal layerInternal stressIonic cleanlinessIsolation

Isolation ResistanceItemKraft paper双面板钻咀钻孔

钻孔粗糙度干菲林干膜线路动态

有机涂覆环氧玻璃基板环氧基树脂蚀刻凹蚀蚀刻

电测试标记电测试曝光外层

夹具可燃性薄金

易曲的,能变形的助焊剂

金板网格地线层

孔的密度孔径孔位

孔位座标表孔位误差孔尺寸热风整平湿度

内层分离隔纸内层内应力离子清洁度孤立

绝缘电阻项目

牛皮纸

PCB常用英文词汇汇编

L lLaminate

Laminate ThicknessLamination void Landless holeLaser plotterLaser plottingLaser via holeLayup

Lay-up InstructionLegendM mMark

Master drawingMaterial ThicknessMaterial TypeMax. X-out

Max.Board Thickness After PlatingMeasling

Mech Drawing No.Mechanical cleaningMetalMethod

MI(Manufacturing Instruction)Microstrip

Min Conductor Copper ThicknessMin Hole Wall Copper ThicknessMin. Gold Plating ThicknessN nNegativeNet listNetworkNick

No. of holes

No.of Array/PanelO oOblongOffset Open/short

Optimization(design)P pPackingPackingPad

Panel Area

Panel Plated CrackPanel platingPanel Size

板材

材料厚度层间空洞破孔

激光绘图机激光绘图激光穿孔层压配本压板指示字符

标记菲林图形材料厚度材料类型坏板上限电镀后总板厚度之上限白斑

图纸编号机械清洗金属方法

生产制作指示微条线

最小线路铜厚最小孔壁铜厚最小金厚反面的

网络表网络缺口孔数

每个拼板套板数

椭圆形的偏移

开路/短路最佳化(设计)包装

包装焊盘

拼板面积板镀缺口整板电镀拼板尺寸Legend Width字符宽度Length

长度Lifted Lands残铜Line Width线宽Liquid液体Location

位置

Logic diagram逻辑图形Logo唛头,标记Lot size批卡

Min. Nickel Thickness

最小镍厚

Min. Tin-Lead Thickness (After HAL)

（喷锡后）最小

锡厚

Min.Annular Ring

最小环宽Min.Spacing between Line to Line

线与线之间的最

小距离

Min.Spacing between Line to Pad

线与焊盘之间的

最小距离

Min.Spacing between Pad to Pad

焊盘与焊盘之间

的最小距离

Minimum 最小Mirroring镜像Missing 缺少Model No.产品名称Molded模塑Mother board主板Moulding模房Mounting hole安装孔Multilayer多层板Multi-layer Laminate多层板材料 No.of Panel per Stack每叠板数

No.of Panel/Sheet每张大料拼板数No.of Pcs Per Bag每包数量No.of Unit/Array每套单元数Normal value标准值

Organic Solerability Peservatives(OSP)有机保护剂Originator原作者Outer copper foil外层铜箔Outline外形

Pitch

间距Placement

放置Plated Though Hole(PTH)沉铜Plating

电镀

Plating Crack电镀裂缝Plating line电镀线Plating rack电镀架

PCB常用英文词汇汇编

Panel Size After Outerlayer CuttingPanel UtilizationPass ratePassivationPattern

Pattern InspectionPattern plating

PCB(Printed Circuit Board)Peck drillingPeel strength PeelablePeelable Peelable MaskPeelingPermanentPH value

Photo plottingPhoto via holePhotographersPhotoplotlerPhysicalPin holePink ringPinning hole

Q qQA Audit

QA(Quanlity Assurance)Quad Palt Pack (QFP)R r

Raw Material UtilizationRecallRectifier

Register markRegistrationRemarkResin

Resin RecessionS s

S/M Material

S/M(Solder Mask)Sales Sample

Sampling inspectionScaling factorScopeScoringScratch

Secondary sideSection Code

Section Code ChangeSegmentSeparatedSequence

外层切板后拼板尺寸拼板利用率通过率钝化线路

线路检查图形电镀印制线路板啄钻

剥离强度可剥性剥离强度可脱油剥离永久性PH值图形输出菲林过孔照片靶标光绘机物理的销定孔粉红环钻孔管位

品质审计品质部

四边扁平林整器件

原材料利用率回收整流器对位点重合点备注树脂流胶

绿油物料阻焊销售样板

抽样检验

缩放比例因素范围刻槽划痕第二面组别代号

组别代号更改部分,片段分离顺序Plating Void电镀针孔Plug Hole塞孔Polymer聚合体Porosity孔隙率Positive绝对的Power plane电源层Prepreg半固化片Primary side首面Print

印刷

Probe point针床测点Process

工序

Process flow

工序流程Product Planning Dept.生产计划部Production生产板Profile外形

Profiling

外形加工Profiling Process外形加工Project No.

产品编号

PTH Thermal Seress TestPTH热冲击测试PTH(Plating Through Hole)沉铜Pull away拉离Punch啤模Punching

冲切

Punching Mould Drawing

啤模图形

Quality质量Quantity数量

Resist抗蚀剂Resolution分辨率Rigid

精密的Roller coating涂覆Roughening粗化Round pad圆盘

Routing外形加工,铣板

Solder mask on bare copper (smobc)裸铜覆盖阻焊膜Solder side

焊接面Solder Side C/M阻焊面字符Solder Side Cir.焊接面线路Solder Side Circuit焊接面Solder Side S/M焊接面阻焊Solderability可焊性Solvent Test可溶性测试Spacing

线距

Special requirement 特殊要求

Specification详细说明，规范Spindle主轴Split

裂片Square pad方块Standard标准值

PCB常用英文词汇汇编

Sets

Sheet Size

Shematic diagramShiny

Silk screenSilver filmSingle/doubleSlot Smear

Solder MaskT tTack

Tape ProgrammingTape TestTarget HoleTeardrop TemplateTentingTest

Test couponTest ParameterTest PatternTesting VoltageThermal shock

U u

Ultrasonic cleaningUndercut

Unit ArrangementV v

Vacunm Pack

Vacuum laminationV-Cut

View From…W w

W/F(Wet Film)Warp & Twist

套

大料尺寸原理图

有光泽的,发光的丝印银盐片单层/双面槽,坑污点阻焊

堆起

铬带制作胶带测试目标孔泪珠天平封孔测试图样

测试参数测试孔电压热冲击

超声波清洗侧蚀

单元排版

真空包装真空压制V- 坑

观察方向由…

湿膜

翘曲和弯曲StaticStencialStep drillingStep scaleStoreSupplier

Supported holeSurface

Surface mount technologySwimming

Thermal stressThicknessTin Content

Tin/Lead StrippingTin-lead platingToleranceTop sideTouch upTrainingTransmissionTransmittanceTrim lineUnit Layout Per PanelUv-blocking Visual & WarpageVisual inspectionVoltage WidthWiring静态网版分布钻光梯尺货仓供应商支撑点表面

表面组装技术滑移

热应力厚度锡含量退铅锡电镀铅锡公差板面

修理(执漏)训练传输线传送修剪

单元拼板图阻挡紫外线

可视性和翘曲度目检电压

宽度线路